Paras Defence and Space Technologies has approved the incorporation of a subsidiary, Paras Semiconductors Private Limited, or another approved name. The new entity will specialize in advanced heterogeneous packaging and 3D packaging (OSAT) for AI, high-performance computing (HPC), networking, and data centers. The subsidiary’s authorized and paid-up share capital is ₹10,00,000, with Paras Defence holding 70% of the equity.
New Semiconductor Venture
Paras Defence and Space Technologies is expanding its business operations by establishing a subsidiary focused on semiconductor assembly and testing. The company’s board of directors approved the incorporation of Paras Semiconductors Private Limited during a meeting held on January 19, 2026.
Focus on Advanced Technologies
The subsidiary will focus on State-of-the-Art Advanced Heterogeneous Packaging and 3D Packaging OSAT (Outsourced Semiconductor Assembly and Testing). Its primary focus will be on key areas such as AI, High-Performance Computing (HPC), Networking, and Data Center Applications.
Financial Details and Ownership
Paras Semiconductors Private Limited will have an authorized and paid-up share capital of ₹10,00,000 (Rupees Ten Lakhs Only), divided into 1,00,000 Equity Shares with a face value of ₹10 each. Paras Defence will hold 70,000 equity shares, representing 70% ownership in the subsidiary, with an investment of ₹7,00,000.
Source: BSE
