Paras Defence and Space Technologies has announced the incorporation of a wholly-owned subsidiary named “Paras Semiconductors Private Limited” on February 27, 2026. This new entity focuses on setting up State-of-the-Art Advanced Heterogeneous Packaging and 3D Packaging OSAT, targeting AI, HPC, and Data Center applications. The parent company holds 70% equity, subscribing to 70,000 shares for a total investment of ₹7.00 Lakhs in cash.
Formation of New Subsidiary Company
Paras Defence and Space Technologies Limited (PARAS) has officially confirmed the incorporation of a new subsidiary, “Paras Semiconductors Private Limited”. This entity was incorporated on February 27, 2026. The incorporation follows an earlier intimation provided by the company on January 19, 2026.
Strategic Focus of the Subsidiary
The primary business objective of the new subsidiary is to establish a presence in advanced semiconductor manufacturing processes. Specifically, it will focus on setting up State-of-the-Art Advanced Heterogeneous Packaging and 3D Packaging OSAT (Outsourced Semiconductor Assembly and Testing). Key application areas for these services include AI, High-Performance Computing (HPC), Networking, and Data Center Applications.
Shareholding and Investment Details
The subsidiary is incorporated in India. PARAS, the holding company, has subscribed to an initial 100% subscription of the Share Capital, with the consideration made entirely in Cash. PARAS has acquired 70,000 Equity Shares, each with a face value of ₹10/-, aggregating to a total investment of ₹7,00,000/- (Rupees Seven Lakhs Only). Following this subscription, PARAS holds 70% of the total Equity Shares in the Subsidiary.
Corporate Authorization
The announcement was authorized and signed by Munjal Sharad Shah, Managing Director, on behalf of Paras Defence and Space Technologies Limited.
Source: BSE
