Kaynes Technology India announces that its subsidiary, Kaynes Semicon, has partnered with AOS and Mitsui to produce India’s first Intelligent Power Module (IPM). The initial shipment of 900 IPMs to AOS marks a significant milestone under the India Semiconductor Mission. The facility in Sanand, Gujarat, aims for full mass production by January 2026, targeting 1.5 million chips per day by Q1 2026-27.
Landmark Achievement in Semiconductor Manufacturing
Kaynes Semicon Private Limited, a subsidiary of Kaynes Technology India, has successfully manufactured and shipped India’s first Multi-Chip Modules (MCMs), specifically Intelligent Power Modules (IPMs), in collaboration with Alpha & Omega Semiconductor (AOS) and Mitsui. The initial shipment of 900 IPMs from their Sanand facility occurred on October 15, 2025.
Details of the IPM Module
The manufactured IPM, under the India Semiconductor Mission 1.0, contains 17 dies, including six IGBTs, two controller ICs, six FRDs, and three diodes. This module is designed to integrate power switching elements and associated circuitry into a compact package for simplifying motor control and other power applications.
Production Capacity and Future Plans
Kaynes Semicon’s Sanand facility is designed for a total capacity of 6.3 million chips per day. Commercial production for AOS has begun, with full mass production targeted for January 2026. AOS is expected to occupy a majority of the initial capacity, ramping up to approximately 1.5 million chips per day by Q1 2026-27.
Strategic Partnerships
The collaboration includes a strategic partnership with Mitsui & Co., to secure critical raw materials. This partnership ensures the supply of essential components like Lead Frame, Wires, and Mold Compound, supporting stable high-volume chip assembly.
Source: BSE
